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About Kitagawa Group
 Ferrite Products
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Products / EMC / EMI
FERRITE CORE / EMI SUPPRESSION FERRITE TILE
FOR CPU ( SD Series )
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EMI
FERRITE
EMI SUPPRESSION
FERRITE TILE FOR CPU
( SD Series )
 
- Thermally conductive ferrite plates designed for EMI absorption
on ICs, CPUs and bus drives
running at high clock speeds.
- Reduced thickness (0.8 mm) (.031") and excellent thermal
conductivity characteristics
allow the tile to be inserted
between CPU and heat sink, providing EMI shielding without
affecting the heat dissipation process.
- The ferrite tiles are available in standard (as shown),
customized sizes and are
optionally supplied with thermally-conductive adhesive transfer
tape for convenient fastening.
 EMI shielding for any type of integrated circuit
that generates radiated emissions within up to 1GHz
frequency range.
- Effective noise attenuation and thermal transfer
in a compact, space saving, heat sink integrated
solution.
Mechanical Characteristics
 Part
Number: SD-28-28-0.8 |
AC
Initial permeability |
650μiac |
Relative
loss factor
(tan δ/μiac) |
20
x 10-6@0.1MHz |
Relative
temperature factor |
12-20
x 10 6 /  |
Thermal
Conductivity |
1
- 5W/m- |
Specific
resistively |
1
x 108 Ω-cm |
Recommended
frequency range |
30MHz
- 1 GHz |
Part
Numbers
| Part No. |
A |
B |
w/Mk |
IMPEDANCE
Ω/100MHz |
| SD-28-28-0.8 |
28.0
(1.102) |
0.8
(0.031) |
1 - 5 |
600 -
2000 |
| SD-28-28-0.8T |
28.0
(1.102) |
0.8
(0.031) |
1 - 5 |
600 - 2000 |
| SD-28-28-1.5 |
28.0
(1.102) |
1.5
(0.059) |
1 - 5 |
|
| SD-28-28-1.5T |
28.0
(1.102) |
1.5
(0.059) |
1 - 5 |
600 - 2000 |
| SD-38-38-2 |
38.0
(1.496) |
2.0
(0.078) |
1 - 5 |
600 - 2000 |
| SD-38-38-2T |
38.0
(1.496) |
2.0
(0.078) |
1 - 5 |
600 - 2000 |
Unit: mm (inch) |
Thermally-Conductive
Adhesive Transfer Tape
(
Optional) |
The
ferrite tile can be optionally
provided with thermally-conductive
adhesive transfer tape
for ambient temperature
bonding on ICs, heat
sinks, flex circuits,
etc.
Product description:
Ceramic-filled acrylic
pressure sensitive
adhesive film supported
on a protective release
liner, featuring an
excellent combination
of thermal conductivity,
electrical insulation
adhesion (with reworkability)
and ease of use.
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