EMI GROUNDING COMPONENTS

HIGH-POINT GROUNDING CONTACT (PART NO. HPC-10-20)( HPC Series )

• Versatile elastic finger insures stable, low resistance electrical contact and provides continuity of the ground draining circuit and excellent current passage between frame elements, chassis and printed circuit boards.

• # Special profile allows the contact inter-distance to vary from 10 to 20 mm (0.390 - 0.785 in).

• Easy to assemble by screw or adhesive tape.

• Various applications where electrical connection between fixed or removable elements of the assembly (circuit on boards, frame, chassis, case panels) is required for EMI shielding or ESD suppression.

• Material:
  Stainless steel - SUS 304-CSP

• Mounting methods:
  M3 (Size 4) screw or Pressure
  sensitive adhesive tape (optional)

• Contact resistance: 0.01 - 0.0001 Ohms

*Specifications and dimensions are subject to change without notice for product improvement.