THERMAL PADS and THERMAL MANAGEMENT

With higher processing speed of today’s electronics, there is a need to manage heat in more efficient ways. Proper thermal management with thermal pads can spell the difference between getting long-life out of your electronic component or losing it to early death.

Computer processors are one of the most common applications for thermal management products. Processors have the potential to get extremely hot when they are used heavily. Most processors come with a fan / heat sink to help manage the temperature. Between the processor and the fan or heat sink is usually a thermal compound or thermal pad. Without this relatively thin strip of material most processors will run far hotter - even to the point of burning out.

Thermal pads are superior in efficiency and last longer than thermal paste - a commonly used material for computer processors and other heat-sensitive components.

Intermark (USA) offers variety of thermal pads and other products for thermal management such as;

• Basic Thermal Pads (0.8 W/mK)
• High Conductivity Pads (1.5 W/mK & 3.0 W/mK)
• Non-Silicon Pads (0.8 W/mK)
• Thermal + EMC in one Pads (1.1 W/mK)

Thermal Pads

	Product Name	Part No.
	COOL PROVIDE Ultra-low hardness (ASKER C 18)for a silicone free sheet.	CPVS
	COOL PROVIDE Ultra-low hardness (ASKER C 23)for a non-silicone sheet	CPHS
	COOL PROVIDE EPDM-based Thermally Conductive Sheet Silicone Free - No Siloxane Gas	CPV
	CHANGE GEL 50 degrees phase change material secures close contact with heating elements Easy and clean handling	CGD, CGDR
	COOL PROVIDE (5W) Highly conformable and strong silicone-based material Thermal conductivity : 5W/m-K	SPVS
	Thermal Pad (1.0W) Ultra-soft silicone-based thermal pad. Thermal conductivity 1.0 W/mK. Available thickness from 1.0 mm ~ 15.0mm. UL94V0.	IM711F
	Thermal Pad (1.5W) Silicone-based thermal pad with high conductivity of 1.5 W/mK and available in 0.5 mm to 10.0 mm. UL 94V0 thicknesses.	IM708
	Thermal Pad (2.0W) Silicone-based thermal pad with high conductivity of 2.0 W/mK and available in 0.5 mm to 10.0 mm. UL94V0.	IM709
	Thermal Pad (3.0W) Silicone-based thermal pads have high conductivity of 3.0 W/mK and available in 0.5 mm to 10.0 mm. UL94V0.	IM710
	Thermal Pad (5.0W) Silicone-based thermal pads have high conductivity of 5.0 W/mK and available in 0.5 mm to 10.0 mm. UL94V0. thicknesses	IM750
	Thermal Pad (7.0W) Silicone-based thermal pads have high conductivity of 7.0 W/mK and available in 0.5 mm to 10.0 mm thicknesses. UL94V0.	IM770

THERMAL MANAGEMENT plus EMC

	Product Name	Part No.
	CHANGE GEL Dual functional sheet for EMC and thermal management 50degreesC phase change - Secures close contact with heating elements	CGE, CGER
	THERMALLY CONDUCTIVE EMI ABSORBER Dual function sheet for EMC and thermal management, silicone free with 1.1 W/mK, 1.8W/mK	EMPV, EMPV2

Thermal Film

	Product Name	Part No.
	THERMAL FILM - IMTF Series A double-faced adhesive tape with good heat conductivity	IMTF

Thermal Grease /Thermal Filler Pad

	Product Name	Part No.
	THERMAL Grease - IMTG Series High performance thermal grease. High thermal conductivity grease.	IMTG
	THERMAL Filler Pad - IMFP Series High performance and flexible thermal hiller pad.	IMFP

HEAT INSULATOR

	Product Name	Part No.
	HEAT INSULATION SHEET Insulates heat from heating elements Thermal insulating material sandwiched between aluminum foils diffuses local heat.	CFP