THERMAL PADS and THERMAL MANAGEMENT

With higher processing speed of today’s electronics, there is a need to manage heat in more efficient ways. Proper thermal management with thermal pads can spell the difference between getting long-life out of your electronic component or losing it to early death.

Computer processors are one of the most common applications for thermal management products. Processors have the potential to get extremely hot when they are used heavily. Most processors come with a fan / heat sink to help manage the temperature. Between the processor and the fan or heat sink is usually a thermal compound or thermal pad. Without this relatively thin strip of material most processors will run far hotter - even to the point of burning out.

Thermal pads are superior in efficiency and last longer than thermal paste - a commonly used material for computer processors and other heat-sensitive components.

Intermark (USA) offers variety of thermal pads and other products for thermal management such as;

• Basic Thermal Pads (0.8 W/mK)
• High Conductivity Pads (1.5 W/mK & 3.0 W/mK)
• Non-Silicon Pads (0.8 W/mK)
• Thermal + EMC in one Pads (1.1 W/mK)

	THERMALLY CONDUCTIVE SHEETS
	Product Name Part No. COOL PROVIDE CPVS COOL PROVIDE CPHS COOL PROVIDE CPV CHANGE GEL CGD_CGDR CPU PAD CPU COOL PROVIDE (5W) SPVS
	THERMAL MANAGEMENT plus EMC
	Product Name Part No. CHANGE GEL CGE COOL PROVIDE CPHS THERMALLY CONDUCTIVE EMI ABSORBER EMPV
	HEAT INSULATOR
	Product Name Part No. HEAT INSULATION SHEET CFP