EMI GROUNDING COMPONENTS

FRAME GROUNDING EDGE SPACER (PART No. FGES-10) ( FGES Series )

• Provides simultaneous support and grounding with quick release capability for PC board assemblies where frequent inspection or removal are expected.

• Light-weight PPE resin base provided with a tinned phosphor bronze conductive strip.

• High quality materials with excellent flexibility provide constant contact pressure and stable contact resistance under heat variation and heavy vibration conditions.

• Single piece with snap-on mounting capability - materials and labor saving solution to replace the classical screw assembled metal spacers.

• Snap-on card edge spacers provide support for printed circuit boards with quick release capability in applications where electrical connection between elements is required for EMI shielding or ESD suppression.

• Ideal labor saving solution for high volume electronic packaging applications.

• Compatible for using in combination with various types of hinged card spacers and corner posts (PHD-10 and KGCP-10).

• Material:
  Resin base - Polyphenylene ether

• Flammability rating - UL94-V0
  Conductive strip:
  Tin plated phosphor bronze
  Thickness: 0.15 mm (0.006 in.)

• Recommended board/panel thickness:
  Top: 1.6 - 2.0 mm (0.063 - 0.080 in.)
  Bottom: 1.0 - 2.0 mm (0.039 - 0.080 in.)

• Mounting hole dimensions:
  Top: 4.0 mm (0.157 in.) in diameter
  Bottom (chassis):
  special profile as shown

• Contact resistance: 0.01 - 0.0001 Ohms

*Specifications and dimensions are subject to change without notice for product improvement.