EMI GROUNDING COMPONENTS

FRAME GROUNDING SPACERS (PATENTED) ( FGS Series )

• Light-weight PPE resin base provided with a tinned phosphor bronze conductive strip.

• High quality materials with excellent flexibility insures constant contact pressure and stable contact resistance under heat variation and heave vibration conditions.

• Single piece with snap-on mounting capability - materials and labor saving solution to replace the classical screw assembled metal spacers.

• Convenient fitting on various inter-board spacing sizes.

• Snap-on card spacers provide support for printed circuit boards fastening to the chassis or base plates in applications where electrical connection between elements is required for EMI shielding or ESD suppression.

• Ideal labor saving solution for high volume electronic packaging applications.

• Material:
  Resin base - Polyphenylene ether
  Flammability rating - UL94-V0
  Conductive strip:
  Tin plated phosphor bronze
  Thickness: 0.15 mm (0.006 in.)
  

• Recommended board/panel thickness:
      Top: 1.6 - 2.0 mm (0.063 - 0.080 in.)
      Bottom: 1.0 - 2.0 mm (0.039 - 0.080 in.)

• Mounting hole dimensions:
      Top: 4.0 mm (0.157 in.) in diameter
      Bottom: 4.8 mm (0.189 in.) in diameter
  

• Contact resistance: 0.01 - 0.0001 Ohms

*Specifications and dimensions are subject to change without notice for product improvement.