EMI GROUNDING COMPONENTS

ON-BOARD CONTACTS (OG Series )

SMT Grounding Contacts for Automated Mounting on PC Board.

• Space-saving FG reinforcement enabled at design stage.

• Space-saving FG facilitated even where screws are precluded.

• Effective for emission and suitable for ESD immunity.

• All EMC solutions can be completed on board, includinggrounding, shielding and filtering.

• Shaped to prevent spring deformation by hook.

FG reinforcement between PC boards
ESD solution for connector
FG reinforcement between PC board and enclosure

TYPE	COMPACT TYPE
Part No.	OG-321610G
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	3.2	1.6	1.0	0.08
Material	Stainless
Surface Finishing	Partial Au plating

TYPE	COMPACT TYPE
Part No.	OG-340815
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	3.4	0.8	1.5	0.08
Material	Be-Cu
Surface Finishing	Partial Au plating

TYPE	COMPACT TYPE
Part No.	OG-450818
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	4.5	0.8	1.8	0.12
Material	Be-Cu
Surface Finishing	Partial Au plating

TYPE	COMPACT TYPE
Part No.	OG-502620R
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	5.0	2.6	2.0	0.08
Material	Stainless
Surface Finishing	Partial Au plating

TYPE	Space-saving Type
Part No.	OG-363040
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	3.6	3.0	4.0	0.1
Material	Be-Cu
Surface Finishing	Sn planting

TYPE	Space-saving Type
Part No.	OG-363050
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	3.6	3.0	5.0	0.1
Material	Be-Cu
Surface Finishing	Sn Planting

TYPE	Fpr big gap
Part No.	OG-603060
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	6.6	3.0	6.0	0.12
Material	Phoshor Bronze
Surface Finishing	Sn Planting

TYPE	Fpr big gap
Part No.	OG-603070
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	6.6	3.0	7.0	0.08
Material	Phoshor Bronze
Surface Finishing	Sn Planting

TYPE	Long stroke
Part No.	OG-503040
Drawing
Dimensions	A	B	C	Board thickness
Unit: mm	5.0	3.0	4.0	0.08
Material	Be-Cu
Surface Finishing	Sn planting

*Specifications and dimensions are subject to change without notice for product improvement.