EMI GROUNDING COMPONENTS

FRAME GROUNDING GUIDE RAILS ( FGR Series )

• Molded black polycarbons rail with spherical metal fingers provides simultaneous rigid guiding support and continuity of the ground draining circuit for the P.C. boards.

• Holds cards firmly on designated positions in the package while the pressure developed by the metal fingers insures constant contact between chassis and the printed circuit for excellent current package.

• Special spherical profile of the contact fingers prevents any scratching effect on the contact surface of the printed circuit (wiping action).

• Contact resistance does not vary in the heat cycle test and remains stable under heavy vibration conditions.

• Easy to assemble and fasten by snap-on rivet or screw mounting and very convenient for fast packaging and servicing operations.

• Guiding, fastening and grounding of P.C. boards in various single-card or rack-package applications where electrical connection between the circuit on board and the frame (chassis) is required for EMI shielding or ESD suppression.

• Material:
      Resin base - UL recognized
          black polyvarbonate
      Flammability rating
          - UL94-V2 (standard)
          - UL94-V0 (on request)
      Contact fingers:
          Tin coated phosphor bronze
          Thickness: 0.2 mm (0.08 in.)

• Mounting methods:
          Nylon snap-in rivets
          (NRP-3** series) or M3 (size 4)
          screw - 2 pcs./3pcs.

• Applicable board thickness:
          1.6 - 2.0 mm (0.063 - 0.080 in.)
  

• Contact resistance: 0.01 - 0.0001 Ohms

*Specifications and dimensions are subject to change without notice for product improvement.